A wafer-scale 3-D circuit integration technology
Burns, J.A., Aull, B.F., Chen, C.K., Chang-Lee Chen, Keast, C.L., Knecht, J.M., Suntharalingam, V., Warner, K., Wyatt, P.W., Yost, D.-R.W.
Published in IEEE transactions on electron devices (01.10.2006)
Published in IEEE transactions on electron devices (01.10.2006)
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Radiation Effects in 3D Integrated SOI SRAM Circuits
Gouker, P. M., Tyrrell, B., D'Onofrio, R., Wyatt, P., Soares, T., Weilin Hu, Chenson Chen, Schwank, J. R., Shaneyfelt, M. R., Blackmore, E. W., Delikat, K., Nelson, M., McMarr, P., Hughes, H., Ahlbin, J. R., Weeden-Wright, S., Schrimpf, R.
Published in IEEE transactions on nuclear science (01.12.2011)
Published in IEEE transactions on nuclear science (01.12.2011)
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SET Characterization in Logic Circuits Fabricated in a 3DIC Technology
Gouker, P. M., Tyrrell, B., Renzi, M., Chenson Chen, Wyatt, P., Ahlbin, J. R., Weeden-Wright, S., Atkinson, N. M., Gaspard, N. J., Bhuva, B. L., Massengill, L. W., Enxia Zhang, Schrimpf, R., Weller, R. A., King, M. P., Gadlage, M. J.
Published in IEEE transactions on nuclear science (01.12.2011)
Published in IEEE transactions on nuclear science (01.12.2011)
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Enhanced resolution for future fabrication
Fritze, M., Keast, C.L., Chen, C.K., Astolfi, D.K., Yost, D.R., Burns, J.A., Chang-Lee Chen, Gouker, P.M., Suntharalingam, V., Wyatt, P.W.
Published in IEEE circuits and devices magazine (01.01.2003)
Published in IEEE circuits and devices magazine (01.01.2003)
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