MOL Local Interconnect Innovation: Materials, Process & Systems Co-optimization for 3nm Node and Beyond
Pal, Ashish, Thareja, Gaurav, Dag, Sefa, Costrini, Gregory, Reddy, Vinod, Xu, Yi, Lei, Yu, Zhang, Aixi, Shen, Gang, Jansen, Alexander, Chen, Zhebo, Gage, Max, Tang, Jianshe, Yang, Yen-Chu, Deshpande, Sameer, Huey, Sidney, Hung, Raymond, Jiang, Hao, Cai, Man-Ping, Abramovitz, Yaniv, Engel, Lior, Naik, Mehul, Wang, Rongjun, Kesapragada, Sree, Ayyagari-Sangamalli, Buvna, Tang, Xianmin, Bazizi, El Mehdi
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
Published in 2022 International Electron Devices Meeting (IEDM) (03.12.2022)
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