Analysis of interconnection reliability of dielectric layer for wafer level chip scale package
Chiyu Wang, Hsieh, Adren, Yaochen Wang, Pai, Archer, Cheng-Tang Pan, Shao-Yu Wang, Chen-Chih Chiu, Bo-Sheng Wang, Tsung-Lin Yang
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
Published in 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2015)
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Conference Proceeding
Cancer cells differentiation by multi-color ZnO and TiO2 nanowires
Wei-Jen Li, Sheng-Chieh Yang, Yi-Chun Shen, Jian-Jang Huang, Tsung-Lin Yang
Published in 2013 Conference on Lasers and Electro-Optics Pacific Rim (CLEOPR) (01.06.2013)
Published in 2013 Conference on Lasers and Electro-Optics Pacific Rim (CLEOPR) (01.06.2013)
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Conference Proceeding