Studies on double-layered metal bumps for fine pitch flip chip applications
Ho-Young Son, Yong-Woon Yeo, Gi-Jo Jung, Jun-Kyu Lee, Joon-Young Choi, Chang-Joon Park, Min-Suk Suh, Soon-Jin Cho, Kyung-Wook Paik
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
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Conference Proceeding
Flip chip assembly on PCB substrates with coined solder bumps
Jae-Woong Nah, Paik, K.W., Soon-Jin Cho, Won-Hoe Kim
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
The solder joint and runner metal reliability of wafer-level CSP (Omega-CSP)
In-Soo Kang, Jong-Heon Kim, Park, I.S., Ki-Rok Hur, Soon-Jin Cho, Hun Han, Jin Yu
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
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Conference Proceeding