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Application of Imagery Modeling and Deep Learning in Chip Thermal Analysis
by
Shi
,
Zuozheng
,
Liang, Kun
,
Zeng, Zeng
,
Shi, Xiupeng
Published in
2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES)
(27.06.2024)
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accuracy
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analytical models
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deep learning
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fpga
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imagery of chip layout
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IEEE Xplore
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