Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
Knickerbocker, J.U., Patel, C.S., Andry, P.S., Tsang, C.K., Paivikki Buchwalter, L., Sprogis, E., Hua Gan, Horton, R.R., Polastre, R., Wright, S.L., Schuster, C., Baks, C., Doany, F., Rosner, J., Cordes, S.
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
Published in Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005 (2005)
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Conference Proceeding
Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver
Patel, C.S., Tsang, C.K., Schuster, C., Doany, F.E., Nyikal, H., Baks, C.W., Budd, R., Buchwalter, L.P., Andry, P.S., Canaperi, D.F., Edelstein, D.C., Horton, R., Knickerbocker, J.U., Krywanczyk, T., Kwark, Y.H., Kwietniak, K.T., Magerlein, J.H., Rosner, J., Sprogis, E.
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
Published in Proceedings Electronic Components and Technology, 2005. ECTC '05 (2005)
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Conference Proceeding
Silicon optical bench for high-speed optical subassemblies [optical receiver]
Baks, C., Schaub, J.D., Doany, F.E., Furman, B., Rosner, J., Ishimura, E., Masaharu, N.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
Thermal impedance measurements of junction-down mounted single-side contact laser diodes
Cohen, G., Lei Shan, Kuchta, D., Furman, B., Rosner, J., Baks, C., Trewhella, L., Tatsuoka, Y., Shirai, S., Takagi, K., Aoyagi, T., Omura, E.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding