The Reflow Attachment and Reliability Testing of Ceramic Chip Carriers
Charles, Harry K., Romenesko, Bruce M.
Published in 19th International Reliability Physics Symposium (01.04.1981)
Published in 19th International Reliability Physics Symposium (01.04.1981)
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Conference Proceeding
Leak rate measurement comparisons [package seals]
Romenesko, B.M., Ely, K.J.
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
Published in 1995 Proceedings. 45th Electronic Components and Technology Conference (1995)
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Conference Proceeding