Moisture diffusion rate in an ultra-low-k dielectric and its effect on the dielectric reliability
Duan, N., Subramanian, V., Olthof, E., Eggenkamp, P., van Soestbergen, M., Braspenning, R.
Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)
Published in 2021 IEEE International Reliability Physics Symposium (IRPS) (01.03.2021)
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Conference Proceeding
Suppression of bond degradation in power IC's: Impact of bond pad design and wafer & package fab processes
Yuan Li, Hui Xie, Olthof, E., Nath, S.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
The effect of fluorine implant on NBTI behaviour in BCD-processes
Olthof, E., Combrie, M., van Marwijk, L., Claes, J., Dubois, J., Thillaigovindan, J., Jianhua Sun, Ng, W.
Published in 2011 IEEE International Integrated Reliability Workshop Final Report (01.10.2011)
Published in 2011 IEEE International Integrated Reliability Workshop Final Report (01.10.2011)
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Conference Proceeding