Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
Nogami, Takeshi, Gluschenkov, Oleg, Sulehria, Yasir, Nguyen, Son, Peethala, Brown, Huang, Huai, Shobha, Hosadurga, Lanzillo, Nick, Patlolla, Raghuveer, Sil, Devika, Simon, Andrew, Edelstein, Daniel, Felix, Nelson, Liu, Junjun, Tabata, Toshiyuki, Mazzamuto, Fulvio, Halty, Sebastien, Roze, Fabien, Okuno, Yasutoshi, Uedono, Akira
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Get full text
Conference Proceeding
Atomic ordering effect on SiGe electronic structure
Yen-Tien Tung, Chen, Edward, Tzer-Min Shen, Okuno, Yasutoshi, Chung-Cheng Wu, Wu, Jeff, Diaz, Carlos H.
Published in 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2014)
Published in 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2014)
Get full text
Conference Proceeding
Irregular Increase in Sheet Resistance of Ni Silicides at Temperature Range of Transition from NiSi to NiSi2
Tsutsui, K., Ruifei Xiang, Nagahiro, K., Shiozawa, T., Ahmet, P., Okuno, Y., Matsumoto, M., Kubota, M., Kakushima, K., Iwai, H.
Published in 2006 International Workshop on Junction Technology (2006)
Published in 2006 International Workshop on Junction Technology (2006)
Get full text
Conference Proceeding