Measuring the impact of data integration in cooperative utilities
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Conference Proceeding
Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies
Zurcher, P., Alluri, P., Chu, P., Duvallet, A., Happ, C., Henderson, R., Mendonca, J., Kim, M., Petras, M., Raymond, M., Remmel, T., Roberts, D., Steimle, B., Stipanuk, J., Straub, S., Sparks, T., Tarabbia, M., Thibieroz, H., Miller, M.
Published in International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138) (2000)
Published in International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138) (2000)
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Conference Proceeding