Manufacturable 22nm FD-SOI Embedded MRAM Technology for Industrial-grade MCU and IOT Applications
Naik, V. B., Lim, J. H., Lee, T. Y., Neo, W. P., Dixit, H., K, S., Goh, L. C., Ling, T., Hwang, J., Zeng, D., Ting, J. W., Lee, K., Toh, E. H., Zhang, L., Low, R., Balasankaran, N., Zhang, L. Y., Gan, K. W., Hau, L. Y., Mueller, J., Pfefferling, B., Kallensee, O., Yamane, K., Tan, S. L., Seet, C. S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y., Pellerin, J., Chao, R., Kwon, J., Thiyagarajah, N., Chung, N. L., Jang, S. H., Behin-Aein, B.
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
Published in 2019 IEEE International Electron Devices Meeting (IEDM) (01.12.2019)
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Conference Proceeding
Backhopping-based STT-MRAM Poisson Spiking Neuron for Neuromorphic Computation
Tan, J., Lim, J.H., Kwon, J.H., Naik, V.B., Raghavan, N., Pey, K.L.
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
Published in 2023 IEEE International Reliability Physics Symposium (IRPS) (01.03.2023)
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Conference Proceeding
Extended MTJ TDDB Model, and Improved STT-MRAM Reliability With Reduced Circuit and Process Variabilities
Naik, V. B., Lim, J. H., Yamane, K., Kwon, J., B., Behin-Aein, Chung, N. L., K, S., Hau, L. Y., Chao, R., Chiang, C., Huang, Y., Pu, L., Otani, Y., Jang, S.H., Balasankaran, N., Neo, W. P., Ling, T., Ting, J. W., Yoon, H., Mueller, J., Pfefferling, B., Kallensee, O., Merbeth, T., Seet, C.S., Wong, J., You, Y. S., Soss, S., Chan, T. H., Siah, S. Y.
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
Published in 2022 IEEE International Reliability Physics Symposium (IRPS) (01.03.2022)
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Conference Proceeding
Origins and Signatures of Tail Bit Failures in Ultrathin MgO Based STT-MRAM
Lim, J. H., Raghavan, N., Kwon, J. H., Lee, T. Y., Chao, R., Chung, N. L., Yamane, K., Thiyagarajah, N., Naik, V. B., Pey, K. L.
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
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Conference Proceeding
Magnetic Immunity Guideline for Embedded MRAM Reliability to Realize Mass Production
Lee, T. Y., Yamane, K., Hau, L. Y., Chao, R., Chung, N. L., Naik, V. B., Sivabalan, K., Kwon, J., Lim, J. H., Neo, W. P., Khua, K., Thiyagarajah, N., Jang, S. H., Behin-Aein, B., Toh, E. H., Otani, Y., Zeng, D., Balasankaran, N., Goh, L. C., Ling, T., Hwang, J., Zhang, L., Low, R., Tan, S. L, Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Quek, E., Siah, S. Y.
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
Published in 2020 IEEE International Reliability Physics Symposium (IRPS) (01.04.2020)
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Conference Proceeding
A Reliable TDDB Lifetime Projection Model Verified Using 40Mb STT-MRAM Macro at Sub-ppm Failure Rate To Realize Unlimited Endurance for Cache Applications
Naik, V. B., Yamane, K., Lim, J. H., Lee, T. Y., Kwon, J., Aein, Behin, Chung, N. L., Hau, L. Y., Chao, R., Zeng, D., Otani, Y., Chiang, C, Huang, Y., Pu, L., Thiyagarajah, N., Jang, S. H., Neo, W. P., Dixit, H., Aris, S.K, Goh, L. C., Ling, T., Hwang, J., Ting, J. W., Zhang, L., Low, R., Balasankaran, N., Seet, C. S., Ong, S., Wong, J., You, Y. S., Woo, S. T., Siah, S. Y.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
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Conference Proceeding
Fast Switching of STT-MRAM to Realize High Speed Applications
Lee, T. Y., Yamane, K., Kwon, J., Naik, V. B., Otani, Y., Zeng, D., Lim, J. H., Sivabalan, K., Chiang, C., Huang, Y., Jang, S. H., Hau, L. Y., Chao, R., Chung, N. L., Neo, W. P., Khua, K., Thiyagarajah, N., Ling, T., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Wong, J., Seet, C. S., Ting, J. W., Ong, S., You, Y. S., Woo, S. T., Siah, S. Y.
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
Published in 2020 IEEE Symposium on VLSI Technology (01.06.2020)
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Conference Proceeding
Lifetime projections and conduction mechanisms for Hafnium based high-k capacitor dielectrics using low thermal budget process
Lee, J.H., Kim, J.P., Lee, J.-H., Kim, Y.-S., Lim, H.-J., Jung, H.-S., Doh, S.J., Lee, N.-I., Kang, H.-K.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
Coding across multicodes and time in CDMA systems for dispersive channels
Park, J., Lim, J.-H., Gelfand, S.B.
Published in 2003 IEEE Wireless Communications and Networking, 2003. WCNC 2003 (2003)
Published in 2003 IEEE Wireless Communications and Networking, 2003. WCNC 2003 (2003)
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Conference Proceeding
THE RESULTS OF COOLING TEST ON HTS POWER CABLE OF KEPCO
Lim, J H, Sohn, S H, Yang, H S, Kim, D L, Ryoo, H S, Hwang, S D
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
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Journal Article
EXPERIMENTAL STUDIES ON CRYOGENIC SYSTEM FOR 22.9 KV HTS CABLE SYTEM
Sohn, S H, Lim, J H, Yang, H S, Kim, D L, Ryoo, H S, Kim, C D, Kim, D H, Lee, S K, Hwang, S D
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
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Journal Article
Advanced MTJ Stack Engineering of STT-MRAM to Realize High Speed Applications
Lee, T. Y., Yamane, K., Otani, Y., Zeng, D., Kwon, J., Lim, J. H., Naik, V. B., Hau, L. Y., Chao, R., Chung, N. L., Ling, T., Jang, S. H., Goh, L. C., Hwang, J., Zhang, L., Low, R., Balasankaran, N., Tan, F., Ting, J. W., Chang, J., Seet, C. S., Ong, S., You, Y. S., Woo, S. T., Chan, T. H., Siah, S. Y.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
PERFORMANCE TEST OF COOLING SYSTEM FOR KEPCO HTS POWER CABLE
Yang, H S, Kim, D L, Lee, B S, Choi, Y S, Sohn, S H, Lim, J H, Ryoo, H S, Hwang, S D
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
Published in Advances in Cryogenic Engineering; Volume 53B (01.01.2008)
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Journal Article
Feasibility of Packaged Interferometric Photonics Micro-Taper Sensor for Cold-Formed Steel Roof Truss Structural Health Monitoring
Oon, W. L., Lin, H. S., Pua, C. H., Lim, J. H., Lim, S. K., Rahman, F. A.
Published in 2019 IEEE 9th International Nanoelectronics Conferences (INEC) (01.07.2019)
Published in 2019 IEEE 9th International Nanoelectronics Conferences (INEC) (01.07.2019)
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Conference Proceeding
Dynamic Tensile Test And Specimen Design Of Auto-body Steel Sheet At The Intermediate Strain Rate
Kim, S B, Song, J H, Huh, H, Lim, J H
Published in WIT Transactions on Engineering Sciences (01.01.2007)
Published in WIT Transactions on Engineering Sciences (01.01.2007)
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Journal Article
STI 28nm pitch guided DSA to enable the 450mm tools qualification and transition
Larrea, Anne-Sophie, Dunn, Shannon, Collison, Wenli, Franca, Daniel, Borst, Christopher, Lee, Janghee, Lim, JongHeun J H, Chang, Stock
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
Published in 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) (01.05.2016)
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Conference Proceeding
Journal Article
Preliminary Study for Gait Phases Detection to Develop a Rehabilitation Equipment for Hemiplegic Patients
Nam, T.W., Cho, J.M., Kim, S.I., Kim, S.H., Lim JH
Published in 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference (2005)
Published in 2005 IEEE Engineering in Medicine and Biology 27th Annual Conference (2005)
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Conference Proceeding
Journal Article
Resistance to Fusarium oxysporum f.sp. lilii in Lilium
Lim, J.H, Rhee, H.K, Kim, Y.J, Lim, K.B, Tuyl, J.M. van
Published in Acta horticulturae (01.01.2003)
Published in Acta horticulturae (01.01.2003)
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Journal Article