Dual-Polarized Patch Array Antennas with Wide Beamwidth for Automotive Radar Applications
Hsu, Pei-Hsin, Liao, Chao-Hsiang, Sun, Jwo-Shiun, Li, Eric S., Chen, Yu-Liang Chun, Chin, Kuo-Sheng
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
Published in 2023 Asia-Pacific Microwave Conference (APMC) (05.12.2023)
Get full text
Conference Proceeding
Generic rules to achieve bump electromigration immortality for 3D IC integration
Hsiao-Yun Chen, Da-Yuan Shih, Cheng-Chang Wei, Chih-Hang Tung, Yi-Li Hsiao, Yu, Douglas Cheng-Hua, Yu-Chun Liang, Chih Chen
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Get full text
Conference Proceeding
The temperature distribution and the thermal behavior in ultra fine pitch micro SnAg solder bump under current stressing
Hsin-Ying Peng, Chang, Y W, Yu-Chun Liang, Chih Chen, Chang, T C, Zhan, C J, Juang, J Y
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Get full text
Conference Proceeding
Direct measurement of temperature distribution in flip-chip micro-bumps under current stressing by using infrared microscopy
Yu-Chun Liang, Chih Chen, Yao, D J, Chang, T C, Zhan, C J, Juang, J Y
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Published in 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (01.10.2010)
Get full text
Conference Proceeding