Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models
Dao-Long Chen, Tz-Cheng Chiu, Shu-Hua Lee, Po-Hsien Sung, Meng-Kai Shih, Tarng, David, Chih-Pin Hung
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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Conference Proceeding
2.5D IC fault isolation using the time domain reflectometry analysis
Shu-Hua Lee, Yu-Hsiang Hsiao, Ping-Feng Yang
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Effect of Multiple Reflow Cycles on Ball Impact Responses of Sn-4Ag-0.5Cu Solder Joints with Immersion Tin Substrate Pad Finish
Yi-Shao Lai, Kao, C.R., Hsiao-Chuan Chang, Shu-Hua Lee, Chin-Li Kao, Wen-How Lan
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
Published in 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (01.10.2008)
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Conference Proceeding