Novel method for NCF flow simulation in HBM thermal compression bonding process to optimize the NCF shape
Hong, Jong Pa, Lee, Su Chang, Han, Sun Woo, Oh, Sang Kun, Park, Sang Sik, Kang, Hyeong Mun, Kim, Won Keun, Kim, Kil Soo, Oh, Dan
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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