Advanced RDL Interposer PKG Technology for Heterogeneous Integration
Jang, Jae-gwon, Suk, Kyoung-lim, Lee, Seok-hyun, Park, Jin-woo, Jeon, Gwang-jae, Park, Jung-ho, Jin, Jeong-gi, Lee, Su-chang, Kim, Gyoung-bum, Choi, Joo-yeon, Kim, Dae-woo, Oh, Dan, Choi, Won-kyoung
Published in 2020 International Wafer Level Packaging Conference (IWLPC) (13.10.2020)
Published in 2020 International Wafer Level Packaging Conference (IWLPC) (13.10.2020)
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