Study of Ga-21.5In-10Sn/Cu Liquid-Solid Interfacial Reaction and Reaction Barrier Layer
Huang, Yaoxuan, Wang, Li, Ma, Haobo, Su, Xiaolin, Zhao, Ning, Ma, Haitao
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Get full text
Conference Proceeding