A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth
Liu Fengman, Li Baoxia, Li Zhihua, Wan Lixi, Gao Wei, Chu Yanbiao, Du Tianmin, Song Jian, Xiang Haifei, Wang Haidong, Yang Kun, Yang Binbin
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
Published in 2011 Asia Communications and Photonics Conference and Exhibition (ACP) (2011)
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Conference Proceeding
Optimizing Hierarchical 3-D Floorplanning with simulated annealing Algorithm
Chengyi, Liao, Qi, Zheng, Fengman, Liu, Huimin, He, Qidong, Wang
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
Thermal characterization of a novel 3D stacked package structure by CFD simulation
Cheng Chen, Delong Qiu, Fengze Hou, Fengman Liu, Meiying Su, Qidong Wang, Liqiang Cao, Lixi Wan
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
A 2T P-Channel Logic Flash Cell for Reconfigurable Interconnection in Chiplet-Based Computing-In-Memory Accelerators
Li, Weizeng, Wang, Linfang, Li, Zhi, Ye, Wang, Zhou, Zhidao, Zhou, Haiyang, Gao, Hanghang, Yue, Jinshan, Hu, Hongyang, Liu, Fengman, Luo, Qing, Dou, Chunmeng
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
Published in 2024 IEEE International Symposium on Circuits and Systems (ISCAS) (19.05.2024)
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Conference Proceeding
Electrical characterization and analysis on the via-solder ball structure
Yi He, Jun Li, Fengman Liu, Peng Wu, Liqiang Cao
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Substrate design of a 3-D microwave front-end multi-chip module with antennas integrated
Peng Wu, Huimin He, Yi He, Lixi Wan, Fengman Liu, Jun Li, Liqiang Cao
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Optimization Design of 2.5D TSV Package Using Thermo-Electrical Co-Simulation Method
Fengze Hou, Yunyan Zhou, Fengman Liu, Meiying Su, Cheng Chen, Jun Li, Tingyu Lin, Liqiang Cao
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Thermal management of 3D RF PoP based on ceramic substrate
Fengze Hou, Fengman Liu, Yi He, Xiaomeng Wu, Xia Zhang, Liqiang Cao, Yuan Lu, Shangguan, Dongkai
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Optical transceiver sub-system package based on SiOB with 8×14Gbps two-way bandwidth
Fengman Liu, Binbin Yang, Baoxiao Li, Haidong Wang, Lixi Wan
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Design and implementation of two different RF SiPs for micro base station
Yi He, Fengman Liu, Peng Wu, Fengze Hou, Jun Li, Jie Pan, Dongkai Shangguan, Liqiang Cao
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Analysis on electromagnetic isolation issues among multi-chips in system in package
Peng Wu, Fengman Liu, Yi He, Huimin He, Jun Li, Liqiang Cao, Dongkai Shangguan, Lixi Wan
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
A collaborative design from schematic to layout: Based on MCP technology
Maoyun Pan, Fengman Liu, Liqiang Cao, Ziguan Zhou, Yang Li
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Reliability research on optoelectronics packaging
Fengman Liu, Haiyun Xue, Fei Wan, Fengze Hou, Baoxia Li, Haidong Wang, Binbin Yang, Jian Song, Lixi Wan, Liqiang Cao
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Crosstalk analysis and optimization of high-speed interconnections
Haidong Wang, Jian Song, Fengman Liu, Haifei Xiang, Wei Gao, Lixi Wan
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Design optimization and performance verification of multi-channel high-speed optical transceiver package
Fengman Liu, Lixi Wan, Jing Zhou, Baoxia Li, Lianmin Du, Wei Gao, Fei Wan
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Optical vertical interconnect and integration based on Silicon carrier
Fengman Liu, Yanbiao Chu, Baoxia Li, Jian Song, Haidong Wang, Tianmin Du, Binbin Yang, Lixi Wan
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding
Failure analysis and test for high speed packaging, HDMI packaging and QSFP packaging
Haifei Xiang, Jian Song, Fengman liu, Wei Gao, Baoxia Li, Lixi Wan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
12-channel board-level multi-GHz optical link using cross-switch chips and optoelectronic multi-chip package modules
Fengman Liu, Zhihua Li, Wei Gao, Haifei Xiang, Jian Song, Baoxia Li, Lixi Wan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Optimization of broadband characterization for pluggable parallel optical transceiver modules on multilayer substrates
Baoxia Li, Wei Gao, Fengman Liu, Haifei Xiang, Jing Zhou, Jun Li, Zhihua Li, Jian Song, Lixi Wan
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
A new measurement method and electrical design for high density optoelectronics integration
Fengman Liu, Baoxia Li, Yunyan Zhou, Wei Gao, Haifei Xiang, Haidong Wang, Jian Song, Zhihua Li, Kun Yang, Jun Li, Liqiang Cao, Lixi Wan
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding