Ultra-thin flexible microcircuit assemblies using thinned die and multilayer thin-film substrates
Francomacaro, A.S., Charles, H.K., Lehtonen, S.J., Keeney, A.C., Clatterbaugh, G.V., Banda, C.V.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
The effect of high temperature intermetallic growth on ball shear induced cratering
Clatterbaugh, G.V., Charles, H.K.
Published in Proceedings., 39th Electronic Components Conference (1989)
Published in Proceedings., 39th Electronic Components Conference (1989)
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Conference Proceeding