Low-K Flip Chip Board Level Reliability on 65nm Technology
Pei-Haw Tsao, Bill Kiang, Wu, K., Abel Chang, Tsomg-Dih Yuan
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Get full text
Conference Proceeding
Cu Bump Flip Chip Package Reliability on 28nm Technology
Tsao, P. H., Hsu, Steven, Kuo, Y. L., Chen, J. H., Chang, Abel, Pu, H. P., Chu, L. H., Lii, M. J.
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Get full text
Conference Proceeding