LAMOST observations in the K2 fields: project and observation progress
Fu, Jian Ning, Smith, Martin C., Zhang, Ru Yuan, Ren, An Bing, Shi, Jian Rong, Luo, A Li, Zhang, Hao Tong
Published in EPJ Web of Conferences (01.01.2017)
Published in EPJ Web of Conferences (01.01.2017)
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Journal Article
Conference Proceeding
Derivation of the green vegetation fraction from TM data of three gorges area
Zhang, An-bing, Liu, Xin-xia, Di, Wei-jin
Published in Procedia earth and planetary science (01.09.2009)
Published in Procedia earth and planetary science (01.09.2009)
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Journal Article
Study of full scale UHV DC transmission line corona performance in corona cage
Wei Wang, Chengrong Li, Yunpeng Liu, Bing Luo, Xiaolin Li, Yitao Jiang, Bing An, Yixu Wang
Published in Conference Record of the 2008 IEEE International Symposium on Electrical Insulation (01.06.2008)
Published in Conference Record of the 2008 IEEE International Symposium on Electrical Insulation (01.06.2008)
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Conference Proceeding
Research on peel strength of flexible copper clad laminate
Jie Shuai, Bing An
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
W2W wafer level vacuum packaging of MEMS devices using solder
Honglin Zhang, Bing An, Chenxu Niu
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Effect of heat treatment on the adhesion characteristics of flexible copper clad laminate with ion injection
Yanli Zang, Jie Wang, Bing An, Yiping Wu, Weiwen Lv, Hui Liu
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Review on simulation methods of micro focal spot x-ray tubes' electron emission system
Jingwen Hu, Weiwen Lv, Bing An, Yiping Wu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Investigation of microstructure and optical property of high power LED based on rapid thermal cycling
Jibing Chen, Yanfang Yin, Jianping Ye, Bing An, Yiping Wu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Digital image distortion and proofreading technology in micro focal spot X-ray inspection
Weiwen Lv, Bing An, Yiping Wu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Application of nano copper conductive ink for printed electronics
Yating Hu, Bing An, Chenxu Niu, Weiwen Lv, Yiping Wu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Influence of rapid thermal cycling on optical property and microstructure of high power LED
Jibing Chen, Bing An, Longzao Zhou, Yiping Wu
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Research on reliability of Sn-1.0Ag-0.5Cu low-Ag lead-free solder alloy
Yating Hu, Bing An, Rong Chen, Weiwen Lv, Yiping Wu
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Investigation on reliability of low-Ag lead-free solder alloy
Yating Hu, Bing An, Yi Zhang, Yiping Wu
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Effect of rapid thermal cycles on the microstructure of single solder joint
Jibing Chen, Yiping Wu, Bing An
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Influence of rapid thermal cycling on the microstructures of single SnAgCu and SnPb solder joints
Jibing Chen, Weiwen Lv, Bing An, Longzao Zhou, Yiping Wu
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Nano copper conductive ink for RFID application
Jian Li, Bing An, Jian Qin, Yiping Wu
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
Published in 2011 International Symposium on Advanced Packaging Materials (APM) (01.10.2011)
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Conference Proceeding
A spatial filtering algorithm in low frequency wavelet domain for X-ray inspection image de-noising
Weiwen Lv, Peng Wang, Bing An, Qiangxiang Wang, Yiping Wu
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Notice of Retraction: Research for innovation mechanism of poor college students subsidy management
Bing An, Yun Zhai
Published in 2010 International Conference on Optics, Photonics and Energy Engineering (OPEE) (01.05.2010)
Published in 2010 International Conference on Optics, Photonics and Energy Engineering (OPEE) (01.05.2010)
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Conference Proceeding
Analysis of delamination and darkening in high power LED packaging
Longzao Zhou, Bing An, Yiping Wu, Shunhong Liu
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
Published in 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (01.07.2009)
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Conference Proceeding